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10W 800nm 200um COS AuSn bonding Laser Diode Module

10W 800nm 200um COS AuSn bonding Laser Diode Module

C8081010W10

Diode Laser808nm

SkyEra delivers TY-808±3nm-10.0W-25C-DG-01 chip on submount diode lasers, employing AuSn bonding and P Down package with multiple advantages of high reliability, stable output power, high power, high efficiency, long lifetime and high compatibility, and are widely applied in the market.

  • Overview
  • Parameters
  • Technical Archive

Features:

l  Chip on submount design

l  P Down sealed package

l  High stability

l  Long lifetime

l  High reliability

l  AuSn bonding

l  RoHS compliance


Application:

l  Medical

l  Printing

l  Industry

l  Pumping


Parameters

Min

Typ

Max

Unit

Conditions

Output Power

-

10

-

W

 

Center Wavelength

Polaris

805

803

808

808

811

813

nm

 

Spectral Width (FWHM)

-

2.5

-

nm

 

Spectral Width (90%)

-

6.0

-

nm

 

Fast-Axis Divergence (95%)

-

64

68

°

Collimating

Fast-Axis Divergence (FWHM)

-

33

35

°

 

Slow-Axis Divergence (95%)

-

9

10

°

 

Slow-Axis Divergence (FWHM)

-

7

8

°

 

Polarization Mode TE/(TE+TM)

95

-

-

%

 

Wavelength Tuning vs. Temperature

-

0.35

-

nm/

 

Emitter Size

185

190

195

μm

 

Threshold Current

-

1.35

1.5

A

 

Operating Current

-

9.5

10.5

A

 

Operating Voltage

-

1.85

2.0

V

 

Power Conversion Efficiency

-

55

-

%

 

Slop Efficiency

-

1.2

-

W/A

 

Storage Temperature

0

25

80

°C

 

Operating Temperature

15

25

55

°C

 

Apparent Size

4.5x5.75x0.482

mm

 


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